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AMD announces more Ryzen 3D package and V-Cache details on Hot Chips

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(Image source: Hot Chips 33 / AMD)
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AMD 3D V-Cache

(Image source: Hot Chips 33 / AMD)
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AMD 3D V-Cache

(Image source: Hot Chips 33 / AMD)

AMD’s 3D V-Cache marks the company’s first foray into 3D packaging, and the company shared more details behind its manufacturing process in a demonstration on Hot Chips 33. As a quick review, 3D V-Cache uses a novel fusion technology with additional 64MB 7nm SRAM cache stacked vertically on top of the Ryzen computing chiplets, which triples the number of L3 caches per Ryzen chip.

This new technology can provide up to 192MB of L3 cache for each chip, and AMD demonstrated that Ryzen 9 5900X uses the new cache to achieve a 15% performance improvement in 1080p games, which is roughly the performance we can get from the new cache . CPU microarchitecture and/or process node. However, AMD accomplished this feat using the same 7nm node and Zen 3 architecture as the standard Ryzen 5000 model. This progress is also accompanied by a single die stacked on top of the chip-AMD says it can stack more than one layer in the future, which will further increase capacity.

AMD revealed after the presentation that it can achieve similar output to the standard Ryzen model through the new 3D V-Cache chip, which means that it has crossed the barriers required to bring the chips. These chips will be put into production by the end of this year. .

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AMD

(Image source: Hot Chips 33 / AMD)
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AMD

(Image source: Hot Chips 33 / AMD)

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