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AMD EPYC Milan-X leaks 64 cores, rumored HBM memory


AMD released EPYC 7003 series The (Milan) processor used in the data center more than a year ago. However, according to reports, the chip maker is preparing for an overhaul in Milan, which includes 3D chip stacking.

points leakers ExecutableFix and Patrick Schur sparked concerns about AMD’s implementation of its X3D chip packaging technology with Milan-X. In terms of design, Milan-X retains the Zen 3 core, and may reach 64 cores, just like the vanilla Milan chip. The focus behind X3D is to provide up to 10 times the bandwidth, so Milan-X may use stacked memory chips.


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