China Yangtze Storage delays its 128-layer 3D NAND

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According to a report from Digital age, The leading Chinese NAND flash memory manufacturer Yangtze River Memory Technology (YMTC) is working hard to achieve its planned production target for its new 128-layer 3D NAND. The company originally planned to achieve a monthly production capacity of 100,000 wafers by the end of 2021. However, due to the unexpectedly low yield of its 128-layer NAND, it is reported that the company expects to achieve its production goal by 2022.
YMTC is also facing other unfavorable factors as it seeks to expand the production scale of its existing nodes-US trade restrictions on semiconductor manufacturing equipment are affecting the company’s ability to increase production. Due to these limitations, YMTC was unable to purchase enough equipment to manufacture flash memory large enough to meet its target of 100,000 WSPM (Monthly Wafer Start) this year.
Fortunately, the delay should be relatively short, and YMTC expects to achieve at least 100,000 WSPM by 2022. Once this goal is achieved, the company hopes to expand to a total output of 300,000 tablets per month.
This delay is likely to only affect Chinese mobile phone and SSD manufacturers, because YMTC is usually used domestically by Chinese mobile phone manufacturers and SSD manufacturers.
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