The US Department of Defense has signed an agreement with Intel to provide commercial foundry services for the Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) program.
Intel Foundry Services (IFS) is a new division of Intel that provides chip designers with the company’s chip manufacturing services. It will work with the Department of Defense to create an foundry ecosystem to produce leading “custom and integrated circuits and commercial products for the Department of Defense.” “System, the initial test chip is being manufactured Intel’s 18A nodeThe dollar value of this contract is currently unknown, but we have contacted Intel for details.
Intel will work with other industry giants such as IBM, Cadence and Synopsys to develop semiconductor IP systems that support the design and manufacture of chips. The first test chips will use Intel’s 18A process, which Intel calls the most advanced node. However, Intel’s 18A will Becoming the company’s second-generation Angrstrom-level process node, and will not be available until early 2025, indicating that this is a long-term contract. Intel will not release the first-generation Angstrom-class chip 20A until 2024.
As part of IDM 2.0 initiativeIntel recently invested US$20 billion in its own funds to build two wafer fabs for IFS services and internal production. But the company has also been seeking government investment in more fabs in the United States and abroad in the media in the audience, taking advantage of the fact that it is the only American company that designs and manufactures chips in the United States. These efforts are made as the United States and European Union countries seek to reduce their dependence on foreign chip production.
Intel’s 18A will be equipped with all the cutting-edge technologies of the company’s 20A process, such as RibbonFET transistors and back-side PowerVia power supply, but with the addition of high NA EUV manufacturing. This is a new ultra-precision version produced by EUV that can etch designs with a smaller (<8nm) resolution than current machines. New machines from ASML will be needed to perform single-pattern EUV with such fine geometries, because existing EUV tools will require less than ideal multi-pattern EUV manufacturing techniques. Intel will be the first company to obtain a High NA EUV machine from ASML.
Intel recently announced IDM 2.0 announcement It will cooperate with IBM on future logic and packaging technologies, and the company will also cooperate with IBM as part of the RAMP-C program. Intel did not disclose too many fine-grained details of its Angstrom-class chips, but they have striking similarities with IBM’s recently announced GAA/nanosheet technology, which is manufactured on 2nm test wafers. This partnership is important to Intel because it hopes to recover from years of process technology stagnation. In our briefing with IBM on its nanosheet technology, the company was very clear that its new 2nm IP will benefit all partners, including Intel.You can read more about similar technologies from IBM here.
“One of the most profound lessons of the past year is the strategic importance of semiconductors and the value of a strong domestic semiconductor industry to the United States. Intel is the only American company that is in a leading position in the design and manufacture of logic semiconductors. Technology. When we When Intel’s foundry service was launched earlier this year, we were very pleased to have the opportunity to provide our capabilities to a wider range of partners, including the US government, and we are very pleased to see the adoption of RAMP-C.”-Intel CEO Pat Gelsinger
Intel’s press release did not outline the size of the US government’s investment or the timetable for the contract, which was issued after Intel won another project last year from the Department of Defense to develop packaging solutions for the US government. We have contacted detailed information about the RAMP-C project and will update as needed.