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Intel will announce the process and packaging technology roadmap in the webcast on July 26

Intel today Announce CEO Pat Gelsinger and the head of the technical department, Dr. Ann Kelleher, will discuss the upcoming “process and packaging innovation” on July 26.

Gelsinger and Kelleher “will gain insight into Intel’s process and packaging roadmap” as IDM 2.0 strategy Announced in March.

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