SK hynix announced plans Mass production of DDR5 memory will begin in the next few months. Commercial DDR5 components manufactured by SK Hynix may be put on the market together with Intel’s Alder Lake platform, which will be launched later this year. In addition, the company will start producing 176-layer 3D/4D NAND flash memory in the second half of the year.
Just like other manufacturers Dynamic random access memoryAs early as 2019, SK Hynix demonstrated the first batch of DDR5 chips and modules, but mass production began in the second half of the year, which is obviously different from engineering samples. So far, SK Hynix has provided samples of its DDR5 IC and insisted on using their platform and upcoming CPU to verify their interested customers. These chips will be mass-produced in the second half of this year to meet the needs of PC manufacturers that will use Intel Alder Lake processors. In the first half of 2022, DDR5 chips will be used in servers equipped with Intel Sapphire Rapids CPUs.
SK Hynix wrote in a statement: “The company revealed that it will start supplying mass-produced 1nm DRAM through EUV equipment and mass-produce DDR5 DRAM in the second half of this year.”
SK Hynix Say Earlier this month, it has begun mass production of LPDDR4-4266 using its 1a nm manufacturing technology using extreme ultraviolet (EUV) lithography. The company said that the new production tool has increased its wafer productivity by 25% (compared to the previous 1znm node), and its new LPDDR4 chip has reduced power consumption by 20% compared to similar previous generation products.
Starting early next year, SK Hynix 1a will also be used to manufacture DDR5 memory, which will replace SK Hynix’s first-generation DDR5 products in the future, because EUV provides substantial power and performance for more complex DDR5 ICs. The benefits, but perhaps more importantly, are in terms of chip size.
In addition to mass production of DDR5 in the second half of the year, SK Hynix will also start mass production of its 176-layer 4D NAND (3D NAND with logic under the memory array) in the next few months.
The company has begun to provide SSD controller manufacturers with samples of 512Gb 176-layer chips, so it is expected that drives based on the new 3D NAND memory will sometimes be launched in 2022. At the same time, the initial applications using the new 3D NAND have always been cheap retail storage solutions, such as USB flash drives and memory cards.