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TSMC explores on-chip, semiconductor integrated water cooling


TSMC, in VLSI Seminar, Recently Introduce its research on on-chip water cooling As a way to solve the heat dissipation problem. It involves integrating the water channel directly into the design of the chip.

Due to denser manufacturing techniques and increased vertical 3D chip stacking, transistors are increasingly compressed together, and temperature has become an increasingly critical issue that needs to be solved. Researchers at TSMC believe that the solution is to allow water to flow between the mezzanine circuits. This is a very simple theoretical solution, but for electronic products, it is an extremely difficult engineering feat.


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