TSMC confirmed on Thursday (Via Bloomberg) It will establish its first semiconductor manufacturing plant in Japan. The fab will use mature professional process technology to produce professional chips and is expected to improve the supply of parts to local customers, including automakers. This means that its factories outside of Japan (in Taiwan and China) will be able to allocate more capacity for various PC applications.
“After conducting due diligence, we announced our intention to establish a professional technology fab in Japan, subject to the approval of the board of directors,” Said CC Wei, CEO of TSMC, is on a conference call with investors and financial analysts. “We have received a firm commitment to support this project from our customers and the Japanese government.”
TSMC’s semiconductor production facilities in Japan will use various 28-nanometer derivative manufacturing processes to process wafers, including numerous 28-nanometer nodes and 22ULP nodes for ultra-low-power applications.These manufacturing technologies are outdated for applications such as smartphone system-on-chip (SoC) and high-performance CPU or GPU, But they are good enough for chips used in the automotive and consumer electronics industries, and will be sufficient in the next few years, because many ICs have a long life cycle. TSMC will begin construction of its fab in 2022 and is expected to begin operations at the end of 2024.
“The fab will use 20nm to 28nm technology for semiconductor wafer manufacturing,” Wei added. “The construction of the fab is planned to start in 2022, and the production is scheduled to start at the end of 2024. More details will be provided after approval by the board of directors.”
Due to the surge in chip demand and the geopolitical situation, the world’s largest foundry is expanding beyond Taiwan.Rumors about TSMC’s intention to establish a professional wafer fab in Japan have been circulating for several months. comfirmed It has conducted due diligence on a professional wafer fab in Japan. In the past few months, the company has assessed the needs of Japanese customers (such as Sony, NXP, Renesas, etc.), set-up costs, and operational efficiency, and concluded that it makes sense to establish a fab in Japan. Said on Thursday.
TSMC has established a research and development center in Japan and has cooperated with the University of Tokyo in various fields. With good local relations, it is natural for TSMC to expand its business in Japan through manufacturing facilities.
At present, TSMC has not disclosed the planned capacity or cost of the fab. It has neither confirmed nor denied the involvement of Sony and the Japanese government in the project.Late last week Nikkei According to the report, TSMC plans to build a large specialty wafer fab in Japan at an estimated cost of approximately US$7 billion. The agency said that the authorities will invest as much as half of the cost of the fab, while Sony will hold a minority stake. According to the Nikkei Shimbun, the production facility will be located near the Sony image sensor factory in Kumamoto Prefecture, on land owned by the electronics giant.