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Although TSMC has never officially launched its subsequent N3 (post-3nm) manufacturing process, sometimes referred to as N2 (or 2nm), it has developed quite aggressive plans for its 2nm wafer processing facility that includes two GigaFabs. The first 2nm fab will be built in the Hsinchu Science Park, but after facing water shortages earlier this year, the company seems to be re-evaluating its plans for the second 2nm fab.
TSMC’s first fab capable of producing chips using its N2 manufacturing technology will be located at the company’s factory near Baoshan, Hsinchu County, northern Taiwan. Last year, the company established a new R1 R&D facility, which will be used for N3 and N2 nodes (according to media reports). There is no report on TSMC’s groundbreaking ceremony at Hsinchu Science Park, but the company has announced that the plant will be constructed in four phases.
foundry plan Construction of the second N2 wafer fab in the Central Taiwan Science Park near Taichung. TSMC already has production facilities near Taichung.But central Taiwan is one of them Suffer the most The recent drought in Taiwan has forced TSMC to use trucks to supply water for its fabs.
According to reports, in order to ensure continuous water supply for its upcoming cutting-edge fab, TSMC is evaluating a plant near Kaohsiung in southern Taiwan. Recently established Qiaotou Science and Technology Industrial Park, report Focus on Taiwan Quoting local media.
In a statement sent to the media, TSMC reiterated its plan to build a second N2-supported GigaFab (a fab with at least 100,000 wafers in operation per month) near Taichung, central Taiwan, but admitted that it has not yet acquired the facility soil of. The company also added that it considered a variety of factors before making a final decision.
The main takeaway is that TSMC still plans to build two GigaFabs that can use its N2 manufacturing technology to process wafers.
In any case, TSMC’s N2 is still in path-finding mode, and in its recent technical seminars, the world’s largest semiconductor foundry manufacturer did not make any official announcements on this node. In addition, please remember that the company’s N3 is expected to be mass-produced by the end of 2022, and there may be various iterations of N3 in the time frame from 2023 to 2024. The company’s N2 manufacturing process will only be at the end of 2024 or 2025. Sometime of the year.
A few years later, after TSMC’s initial wafer fab in the Hsinchu Science Park began to use N2 for mass production, it will take some time for the company to fully increase the production capacity of the four-stage equipment. For this reason, it will not need another GigaFab that supports N2 until sometime in the second half of this century. In other words, TSMC has enough time to determine the location of its second chip factory that supports N2.
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