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Wafer-level heterogeneous chips may pave the way for surpassing Moore’s Law

The Moore’s Law journey is a technologically complex and expensive journey, multi-billion-dollar R&D-just ask the semiconductor manufacturer. The well-known “soft” law created by Intel co-founder Gordon Moore states that the number of transistors in densely packaged semiconductors should double every two years. The demise of Moore’s Law has been hailed time and time again, and is now understood more as a goal than a rule-but it is a necessary goal for silicon designers to compare. However, the ever-increasing density of transistors presents many challenges to system designers-physics and current state of the art always have limitations that define the hard limit on how many transistors can be pushed into a single chip. As transistor density and chip size increase, the impact of manufacturing defects (which may render some chips unusable) must also be taken into consideration.

Semiconductor designs for decades have favored monolithic monolithic chips, until AMD demonstrated the powerful features of its Zen-based chiplets—in essence, AMD pioneered the mainstream use of smaller semiconductor “blocks” (in Zen, CCX (Or Core Complex as a representative) and then glued together (in Intel’s own words) together into the final chip, interconnected by AMD’s own Infinity Fabric (responsible for transferring information from one chiplet to another). This bypasses some of the limitations of currently available semiconductor manufacturing processes, because smaller chips are less likely to have manufacturing defects, and allow chip designers to better distribute computing resources to account for the density of transistors and these closely packed together. Achieve a better balance between heat components. Even if chiplets are becoming more and more popular in the industry and may become the new de facto standard for performance expansion (Nvidia and Intel have also been exploring chiplets and MCM [Multi-Chip Modules] For future products), there are still some players looking for new ways to improve chip performance density, such as Cerebras, which has 2.3 trillion transistors, 850,000 cores and 15 kW power requirements. Wafer level engine 2.

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